Semiconductor Test Board

The Load Board serves as a crucial interface connecting the test unit of semiconductor testing devices to the physical circuit of the Device Under Test (DUT). It is typically mounted on probe test consoles, handlers, or other test hardware, with wiring connecting the test machine’s signal cards to the DUT’s pins.

Primarily used in post-packaging IC testing, the load board helps identify and sort ICs with incomplete or defective functions. This step is vital to ensure the overall quality of semiconductor products and to minimize the risk of defective chips reaching production or end users. Common load board models include the 93K, T2000, and TUF series.

Technical Specifications:

• PCB Technology: Hybrid

• Materials: SYL + Rogers (S1000-2M + 4350B)

• Layer Count: 8

• Board Thickness: 2.0 mm

• Copper Finish: 35 μm

• Line Width/Space: 2.8/2.8 mil

• Surface Finish: Immersion Gold

• Special Features: Resin plugging and capping

Burn-In Board (BIB)

The Burn-In Board (BIB) is designed to conduct rigorous aging tests on packaged ICs by subjecting them to controlled environmental stresses over specified durations. This process verifies the long-term reliability of the ICs under varying conditions such as temperature, voltage, and signal fluctuations.

ICs are mounted via sockets or holders on the BIB and tested inside ovens to simulate real-world operating conditions (e.g., HTOL, HAST). The resulting bath-tub curve enables early detection of potentially defective components, improving product reliability and reducing failure rates in the field.

Logic IC Probe Card

The Logic IC Probe Card acts as a critical interface between the Device Under Test (DUT) and Automatic Test Equipment (ATE) during various IC testing procedures. It facilitates the transmission of electrical signals and power, making precise design and inspection of signal integrity (SI) and power integrity (PI) essential. Ensuring these parameters are strictly controlled prevents inaccurate test results and guarantees reliable verification of IC functionality.