Thermal Management

As modern designs like 5G and advanced communication projects increase component density and power amplification, effective thermal management becomes essential. Challenges such as limited thermal paths and heat buildup must be addressed to ensure PCB performance and reliability.

Voltroncircuits offers a comprehensive range of innovative thermal management solutions, including embedded heat transfer techniques. Our processes feature solid-plated µVias, embedded metal structures (“coins”)—both flush-mounted and cavity recessed—and surface-attached heat transfer media. These technologies efficiently dissipate heat within PCBs, enhancing device longevity and performance.