ML Rigid & HDI

At Voltroncircuits, we have over a decade of expertise in advanced multilayer (ML) and High-Density Interconnect (HDI) PCB technologies, which form the foundation of many high-performance electronic products today. Our capabilities span from early-stage prototyping during New Product Introduction (NPI) through to large-scale mass production, all executed within the same certified manufacturing environment. This approach ensures seamless scalability and optimized production cycle times tailored to your business needs.

Our production expertise includes a wide range of advanced features to meet the most demanding design and performance requirements:

• Blind and Buried Vias: Enhancing circuit density while maintaining signal integrity through precise mechanical and microvia implementations.

• Stacked Microvias for HDI: Enabling ultra-fine interconnects in compact designs, ideal for space-constrained applications.

• High-Speed and Ultra Low-Loss Materials: Supporting high-frequency signal transmission with minimal signal degradation.

• Thermal Solutions: Incorporating attached or embedded copper “coins” for effective heat dissipation in power-sensitive applications.

• RF Materials and Hybrid Build-Ups: Designed for robust performance in radio-frequency and mixed-technology PCBs.

• Cavity and Recessed Milling: Allowing complex board geometries and component embedding for space optimization.

• Back-Drilling: Reducing signal reflections and improving signal quality in high-speed circuits.

• Resin Plugging and Capped Vias (VIPPO): Ensuring reliability and durability of vias in demanding environments.

Voltroncircuits delivers precise, reliable, and scalable ML and HDI PCB manufacturing solutions to power your next-generation electronic products, meeting the highest standards of quality and performance.